DRAM
Lithography
1989
4Mb
16Mb
64Mb
256Mb
1Gb
.8µm
.65µm
.35µm
.15µm
.13µm
1994
1998
2001
2004
Key Challenges
New Gate Materials
W Plugs
Lithography (I-Line, DUV, UV)
New Capacitors
Barrier Films
Gap Fill
STI
Low K Dielectric
Ultra Shallow Junctions
Cu Interconnect
CMP Oxide/Metal
Strip,Wet,RTP, Electro Cu
PECVD, Strip
RTP
LPCVD, RTP
LPCVD, RTP
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