Properties

Properties

 

At December 29, 2007, our major facilities consisted of:

(Square Feet in Millions)   United States   Other Countries   Total
             
Owned facilities(1)   28.1   15.6   43.7
Leased facilities(2)   1.7   2.7   4.4
Total facilities   29.8   18.3   48.1
(1) Leases on portions of the land used for these facilities expire at varying dates through 2062.
(2) Leases expire at varying dates through 2021 and generally include renewals at our option.

Our principal executive offices are located in the U.S. The majority of our wafer fabrication and R&D activities are also located in the U.S. Outside the U.S., we have wafer fabrication at our facilities in Ireland and Israel. We are building a new wafer fabrication facility in Israel, which is expected to begin production in the second half of 2008. In addition, we are building a new wafer fabrication facility in China that is expected to begin production in 2010. Our assembly and test facilities are located overseas, specifically in Malaysia, China, the Philippines, and Costa Rica. We are building a new assembly and test facility in Vietnam, which is expected to begin production in 2009. This facility will have more square footage than each of our current assembly and test facilities, which will enable us to take advantage of greater economies of scale. In addition, we have sales and marketing offices located worldwide. These facilities are generally located near major concentrations of users.

With the exception of certain facilities that we have placed for sale (see "Note 16: Restructuring and Asset Impairment Charges" in Part II, Item 8 of this Form 10-K), we believe that our existing facilities are suitable and adequate for our present purposes and that the productive capacity in such facilities is substantially being utilized or we have plans to utilize it.

We do not identify or allocate assets by operating segment. For information on net property, plant and equipment by country, see "Note 22: Operating Segment and Geographic Information" in Part II, Item 8 of this Form 10-K.

© 2008 Intel Corporation