Architecture The common logic structure of a family of programmable integrated circuits. The same architecture may be realized in different manufacturing processes.

CAE (Computer Aided Engineering) The hardware and software tools used by engineers to design and verify new electronic systems.

Chip Another term for an integrated circuit (IC).

CMOS (Complementary Metal Oxide Semiconductor) An advanced IC manufacturing process technology characterized by high integration, low cost, low power and high performance. CMOS is the preferred process for today's high density ICs.

Development System Software that translates an engineer's logic design to implement the customer's logic requirements in a programmable logic IC.

EPLD (Erasable Programmable Logic Device) Programmable logic devices characterized by an architecture offering high speed, predictable timing and simple software. EPLDs address the market for applications requiring lower density and higher speed than FPGAs.

Fabless Semiconductor Companies A class of semiconductor companies that design, test and sell ICs, but subcontract wafer manufacturing by forming alliances with silicon wafer manufacturers.

FAE (Field Applications Engineer) A field-resident engineering expert who provides on-site technical support for customer applications.

FPGA (Field Programmable Gate Array) A class of integrated circuits pioneered by Xilinx for which the logic function is defined by the customer using Xilinx development system software AFTER the IC has been manufactured and delivered to the end user. Gate arrays are another type of IC whose logic is defined DURING the manufacturing process.

Gate The most basic logic element. Xilinx programmable logic products offer 500-25,000 usable gates per chip.

IC (Integrated Circuit) A single piece of silicon on which thousands of transistors are combined. ICs are the major building blocks of modern electronic systems.

Logic One of the three major classes of ICs in most electronic systems: microprocessors, memory and logic. Logic is used for data manipulation and control functions that require higher performance than a microprocessor can provide.

Logic Density The amount of logic, measured in gates, that may be integrated into a single IC.

Process Technology The 'recipe' used to convert blank silicon wafers into finished wafers containing dozens to thousands of chips. These chips are tested and assembled into plastic or ceramic packages before final use.

SRAM (Static Random Access Memory) A high-volume commodity memory product employing CMOS process technology. Xilinx FPGAs use this same process technology, which ensures high reliability, long-term availability and cost advantages over non-standard processes.

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